ESTIMATION OF COPPER ELEMENTS HEAT REMOVAL EFFICIENCYOF TECHNLOGICAL EQUIPMENT WITH A DIFFUSION PROTECTIVE LAYER

Abstract

The paper notes the prospects for using thermal diffusion hardening to protect copper elements of various
technological equipment from high temperatures. The structures of diffusion layers obtained on M1 grade technical copper
after processing in a saturating powder medium have been investigated. The medium provides a complex saturation
of the surface with several elements, mainly aluminium. For research the thermophysical properties of a copper plate
element with a different thicknesses diffusion layer, the rate of its heating by a gas flame has been studied. According to
the results of the experiment, taking into account the selected calculation model built based on the heat balance, data have
been obtained on the thermal conductivity coefficient of the diffusion layer, which is expressed by an integral indicator.
The heat removal efficiency of a lamellar copper element with different thicknesses of the diffusion layer has been
evaluated. The evaluation has been carried out based on the heating rate and the temperature difference at the control
points along the length of the element.

Fig. 5. Table 1. Ref.: 11 titles.